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123 pages • missing pub info (editions)
ISBN/UID: 9781848000261
Format: Hardcover
Language: English
Publisher: Springer
Publication date: 01 December 2007
Description
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconn...
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123 pages • missing pub info (editions)
ISBN/UID: 9781848000261
Format: Hardcover
Language: English
Publisher: Springer
Publication date: 01 December 2007
Description
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconn...
Community Reviews
Content Warnings